KTEP1
Enhanced insulation: using a bare thermistor chip
Sensing part: aluminium Wire: cross-linked PE parallel, PVC parallel
Features
- A bare thermistor chip is sealed into a lug terminal
- Lower cost than using a glass-encapsulated thermistor element
| Applications | Heatsinks (surface); printer & multi-function printer chambers (ambient) |
|---|---|
| Operating temperature | -30 to +85℃ |
| Thermal time constant | τ ≒ 20 sec. (on an aluminium hot plate) |
| Dissipation constant | δ ≒ 5.5mW/℃ |
| Withstand voltage | 1200VAC for 1 sec. |
| Insulation resistance | ≥100MΩ at 500VDC |
| Resistance | Optional |
| B constant | Optional |
Note 1) Values in the above table are for reference only.
Note 2) Unless otherwise stated, the thermal time constant and the dissipation constant are measured in still air.
